DC to 26 GHz - Low Noise - Ultra Small Footprint

For less than one Euro*

Avago’s revolutionary WaferCap chipscale packaging technology gives you the performance
characteristics of a ceramic package with the size and convenience of plastic packages.

With a footprint of 1.0mm x 0.5mm and broadband operation upto 26GHz this new family of products
will revolutionise your design giving you higher performance in a smaller space.

WATCH VIDEO
Bias Condition Specifications @ 50 Ohms match
WHITE PAPER
Part No
Freq
Vd
Id
Test
NF
Gain
P1dB
OIP3
Release Date
Datasheets
(GHz)
(V)
(mA)
Freq
P1dB
(dB)
(dBm)
(dBm)
VMMK-1218
DC-18
3
20
10
0.71
9
+12
+22
NOW!
VMMK-1225
DC-26
2
20
12
0.87
11
+8
+23
NOW!
VMMK-2103
0.5-6.0
5
25
3
2.4
14
-
+23
Q4
VMMK-2203
1.0-10
5
28
5
2.4
16
-
+15
Q4
VMMK-2303
0.5-6.0
1.8
20
6
2.2
13
+10
+24
Q4
VMMK-2403
2.0-4.0
5
50
3
2.5
15
+20
+32
Q4
VMMK-2503
1.0-12
5
60
3
3.7
14
+17
+28
Q4

*for orders over 5,000 pcs


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