DC to 26 GHz - Low Noise - Ultra Small Footprint
Avago’s revolutionary WaferCap chipscale packaging technology gives you the performance
characteristics of a ceramic package with the size and convenience of plastic packages.
With a footprint of 1.0mm x 0.5mm and broadband operation upto 26GHz this new family of products
will revolutionise your design giving you higher performance in a smaller space.
| WATCH VIDEO | WHITE PAPER | ||||||||
| Part No | Freq |
Vd |
Id |
Test |
NF |
Gain |
P1dB |
OIP3 |
Release Date |
| Datasheets | (GHz) |
(V) |
(mA) |
Freq |
P1dB |
(dB) |
(dBm) |
(dBm) |
|
VMMK-1218![]() |
DC-18 |
3 |
20 |
10 |
0.71 |
9 |
+12 |
+22 |
NOW! |
VMMK-1225![]() |
DC-26 |
2 |
20 |
12 |
0.87 |
11 |
+8 |
+23 |
NOW! |
VMMK-2103![]() |
0.5-6.0 |
5 |
25 |
3 |
2.4 |
14 |
- |
+23 |
Q4 |
VMMK-2203![]() |
1.0-10 |
5 |
28 |
5 |
2.4 |
16 |
- |
+15 |
Q4 |
VMMK-2303![]() |
0.5-6.0 |
1.8 |
20 |
6 |
2.2 |
13 |
+10 |
+24 |
Q4 |
VMMK-2403![]() |
2.0-4.0 |
5 |
50 |
3 |
2.5 |
15 |
+20 |
+32 |
Q4 |
VMMK-2503![]() |
1.0-12 |
5 |
60 |
3 |
3.7 |
14 |
+17 |
+28 |
Q4 |
*for orders over 5,000 pcs






